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CdTe films deposited by helicon sputtering for p-type Hg0.77Cd0.23Te surface passivation

机译:螺旋溅射沉积CdTe膜用于p型Hg0.77Cd0.23Te表面钝化

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Abstract: We investigated the passivation properties of CdTe films that were deposited on p-type Hg$-0.77$/Cd$-0.23$/Te using the helicon sputtering method. Crystallinity and morphological microstructure of the CdTe films were determined by transmission electron microcopy and atomic force microscopy, respectively. We found that the CdTe films are polycrystalline and provide good morphological properties: they have no granular-type defects and no pin-holes. Electrical measurements of metal-insulator semiconductor devices showed that the properties of the CdTe/HgCdTe interface mainly depend on deposition pressure and the conditions of post-deposition annealings. It was observed that CdTe deposition at higher pressure reduces the surface deposition damage that is responsible for increasing the positive fixed charges, the slow traps and other degradations of the HgCdTe surface. Moreover, post-deposition annealing at a temperature above 100 degrees Celsius improves the thermal stability of the electrical properties of the interface. A gate-controlled diode that was produced with post-deposition annealing showed that CdTe films deposited by helicon sputtering were essentially suitable for passivation of HgCdTe photodiode arrays. !5
机译:摘要:我们研究了采用螺旋溅射法在p型Hg $ -0.77 $ / Cd $ -0.23 $ / Te上沉积的CdTe膜的钝化性能。用透射电子显微镜和原子力显微镜分别测定了CdTe薄膜的结晶度和形貌的微观结构。我们发现CdTe薄膜是多晶的,并具有良好的形态学特性:它们没有颗粒状的缺陷,也没有针孔。金属绝缘体半导体器件的电学测量表明,CdTe / HgCdTe界面的性能主要取决于沉积压力和沉积后退火的条件。观察到,在较高压力下CdTe的沉积减少了表面沉积的损害,该损害导致增加HgCdTe表面的正固定电荷,缓慢的陷阱和其他降解。此外,在高于摄氏100度的温度下进行沉积后退火可改善界面电性能的热稳定性。用沉积后退火生产的栅极控制二极管表明,通过螺旋溅射沉积的CdTe膜本质上适用于HgCdTe光电二极管阵列的钝化。 !5

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