Ku Band Metallic Via Through Interconnect–Stripline Capacitive Transitions for Non-Standard PCB Via Setup Using Sequential Build-Up Technology

摘要

This manuscript proposes a multi-path metallic via through interconnect stripline transition as a Printed Circuit Board (PCB) technology limitations work-around for via setup definition in multi-layer PCB design. The structure operates at the Ku band and presents a strong robustness to layer misalignment within the capabilities of the manufacturers, turning it in a reliable solution for low cost industrial production. The low phase delay differences between paths and homogeneous loss makes it possible for use on true-time-delay beamforming applications, such as passive phased arrays based on Rotman Lenses.