Bunch of Wires: An Open Die-to-Die Interface

摘要

Bunch of Wires (BoW) is a new open die-to-die (D2D) interface. BoW's objective is to allow designers to gracefully trade-off performance for design and packaging complexity across a wide range of process nodes. BoW bandwidth can range from 80 Gbps per 16-bit BoW slice with a simple design to 512 Gbps with complex design and packaging. With this flexibility, BoW directly enables heterogeneous integration, a primary advantage of chiplets. In turn, this will enable economies of scale for services and technologies for BoW. In this paper, we discuss progress on the BoW specification based on extensive design and performance studies by engineers from multiple companies. These studies aim to specify BoW so as to make it easy to use in a system. This open innovation project will deliver a low-complexity D2D interface with competitive power-performance metrics with the economies of scale associated with an open ecosystem.