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Fault isolation of die level crystal defect failure mechanism through OBIRCH analysis and micro-probing

机译:模液晶体缺陷失效机制的故障隔离通过obirch分析和微探测

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摘要

Generally, crystal defect is able to induce photon emission event for detection by emission microscopy (EMMI) equipment. However, due to thick, dense metallization and high doped substrate, effective detection by EMMI alone is not always reliable. Thus, further isolation, layout information and verification are required through OBIRCH analysis, CAD navigation and micro-probing sequence respectively.
机译:通常,晶体缺陷能够通过发射显微镜(EMMI)设备来诱导光子发射事件进行检测。然而,由于厚,致密的金属化和高掺杂的基底,单独的EMMI有效检测并不总是可靠的。因此,通过obirch分析,CAD导航和微探测序列,需要进一步隔离,布局信息和验证。

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