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Surface elemental quantification of Au-Pd pre-plated leadframe by means of X-ray Photoelectron Spectroscopy

机译:借助于X射线光电子谱的Au-Pd预镀引线框架的表面元素数量

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Quantification of sample with Palladium (Pd) and Gold (Au) using X-ray Photoelectron Spectroscopy (XPS) could be a great challenge due to the overlapping of Pd, Au and Oxygen photoelectron lines. Conventional baseline subtraction method is not applicable when the content of Pd is too low. A metrology for Pd-Au pre-plated leadframe surface atomic percent quantification using XPS deconvolution method was demonstrated to be able to quantify Pd-Au pre-plated leadframe with low Pd content. Three XPS wide scans were performed on the same analysis spot at energy resolutions of 1 eV/step, 0.5 eV/step and 0.1 eV/step respectively. The same metrology was utilized for atomic percent quantification and compare the accuracy based on deconvolution results.
机译:使用X射线光电子谱(XPS)用钯(Pd)和金(Au)的样品的定量可能是由于PD,AU和氧气光电子线的重叠而产生的巨大挑战。当PD的含量太低时,常规基线减法方法不适用。使用XPS去卷积法对PD-AU预镀引线框架表面原子百分比定量的计量进行说明,可以通过低PD含量来定量PD-AU预镀引线框架。在1eV /步骤,0.5eV /步骤和0.1eV /步骤的能量分辨率下对相同的分析点进行三个XPS宽扫描。用于原子百分比量化的相同计量,并基于去卷积结果进行比较精度。

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