Cross-sectioning Technique for Bonded Silicon Substrates with Face-to-Face Interlaced Carbon Nanotubes in Microchannels

摘要

Cross-sectioning plays an important role in failure analysis. However, commonly used polishing method affects the bonded silicon microchannels and face-to-face interlaced carbon nanotubes (CNTs). Polishing damages the edge of the microchannels and the debris from polishing may be trapped in the microchannels. This paper proposes a novel cross-sectioning technique to realize precise cross-sectioning while maintaining the integrity of bonded silicon microchannels and face-to-face interlaced CNTs. Result shows intact cross-sectioning of the microchannels and CNTs inside.