The fabrication of thin-film micro-LED arrays using tape-assisted laser lift-off: towards rigid and flexible micro-displays

摘要

We report the fabrication of wafer-level thin film micro-LEDs using a tape-assisted laser lift off (TALT) process. The TALT technique not only allows the wafer-scale transfer of micro-LED to an adhesive tape with high-yield and high accuracy, but also suited for the subsequent hetero-integration for display purposes. The TALT technique can be further adapted for high-accuracy, fast selective transfer. As a result, the pixel-to-pixel distance and also display resolution of the micro-LEDs can be accurately tuned. Based on a bump-less bonding process, we have further demonstrated both planar and flexible displays by integrating micro-LEDs onto the driver circuit. These devices may find application in areas such as VR/AR, wearables, and smart watches.