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98 Endurance Error Reduction by Hard_Verify for 40nm TaOx based ReRAM

机译:Hard_Verify针对基于40nm TaOx的ReRAM降低了98%的耐久性误差

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This paper proposes Hard_Verify technique for 40nm TaO $_{X} -$based resistive random access memories (ReRAM). The proposed technique is a new Verify operation leads to enhancing the reliability of endurance. Verify criteria of proposed Hard_Verify is changed to expand executing area as compared with conventional Verify. With Hard_Verify, measured Bit-Error Rate (BER) of low resistance state (LRS) is reduced by 98% at high endurance cycles $= 10 ^{5, }$as compared with conventional Verify. In addition, the optimal write process applying Hard_Verify is investigated to reduce tail error cells (tail bits) at high endurance cycles. To explain such enhancement of the endurance reliability, the physical model is discussed based on oxygen vacancy $(mathrm{V}_{O})$ diffusion.
机译:本文提出了40nm Tao $ _ {x} - 基于$基于电阻随机存取存储器(RERAM)的硬化技术。所提出的技术是一种新的验证操作,以提高耐久性的可靠性。与传统验证相比,已更改建议的HARD_VERFIFY的标准以扩展执行区域。对于HARD_VERIFY,与传统验证相比,低电阻状态(LRS)的测量误码率(LRS)的低电阻状态(LRS)的比特误差率(LRS)降低了98%。此外,研究了应用Hard_verify的最佳写入过程,以减少高耐久性周期的尾误差细胞(尾位)。为了解释这种提高耐力可靠性,基于氧气空缺$(\ mathrm {v} _ {o})$扩散来讨论物理模型。

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