Design and characterization of differential Signal Integrity interconnects at Millimeter-Wave PCB

摘要

In this paper, a Signal Integrity test board is designed to evaluate differential calibration and de-embedding methods at millimeter-Wave frequency band: Differential Crosstalk TRL (Thru-Reflect-Line) and Differential 2x-Thru de-embedding. For DUT's result, S21 phase delay are same, but differential Crosstalk TRL shows non-causality issue together with higher error at S21 amplitude. Finally 2×- Thru is selected at several typical de-embedding scenarios: PCB parameters extraction (Dk, Df and Surface Roughness) up to 67 GHz; Ultralow loss PCB material evaluation (Panasonic Meg 7, TUC TU933+, Nelco MW4000 and Isola Tachyon-100G); Multichannel skew test (less than 1 ps) with one port de-embedding.