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Aerosol Jet Printing of Electronics: An Enabling Technology for Wearable Devices

机译:电子气溶胶喷射印刷:可穿戴设备的辅助技术

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Additive manufacturing has revolutionized the way products are designed and fabricated to include the field of printed electronics. Direct write (DW) technologies used to print three-dimensional (3D) electronic and sensor devices have experienced spectacular growth due to their capability to offer rapid prototyping of high-performance devices for a broad range of applications. This growth is driven by many factors to include significantly reduced design-to-product lead time and fabrication of complex geometries on conformal and flexible substrates. Originally developed by the Defense Advanced Research Projects Agency (DARPA) Mesoscopic Integrated Conformal Electronics (MICE) Program for the fabrication of mesoscale electronics, DW technologies have been explored for a range of applications including active and passive components, sensors, 3D structures, as well as applications in biology. This paper focuses on one emerging DW approach, Aerosol Jet Printing (AJP), as a non-contact method to print fine features using different types of materials over various surfaces. Aerosol Jet systems are able to print a wide variety of electronically, optically, and biologically functional materials on geometrically complex substrates that can be conformal, flexible, and stretchable. The Aerosol Jet process utilizes printable inks based on solutions or nanoparticle suspensions and can include metals, alloys, ceramics, polymers, adhesives, and/or biomaterials. A wide variety of substrates, to include silicon, polyimide, glass, FR-4 and aluminum oxide can be used to print these materials provided the ink is compatible with the substrate. Like other DW technologies, the AJP process offers the distinct benefit of fabrication without conventional masks, with a reduction in material consumption due to selective deposition of inks at digitally defined locations on the substrate. Use of this additive process eliminates the waste of hazardous materials used in the etching processes employed by subtractive methods. AJP systems use an atomizer to create a dense aerosol of micro-droplets that are focused into an aerosol stream, resulting in deposits that can be one tenth the size of the nozzle opening at a standoff height of up to 5 millimeters. These capabilities enable the fabrication of highly integrated devices expanding from the originally targeted mesoscale application to micro- and nano-scale applications. Design and innovative fabrication of more connected and “smart” products can be realized using AJP to meet the miniaturized, flexible, and conformal form factors desired in today's Internet of Things (IoT) global marketplace. AJP technology has opened up new avenues for bio-integrated electronics to include electronic textiles, wearable electrochemical systems, electronic epidermal tattoos, and permanent and dissolvable implantable devices. While it has been demonstrated that AJP is an enabling technology in the growing field of wearable devices, there are major challenges in widespread adoption of this innovative approach. This paper provides an overview of AJP technology and summarizes the historical underpinning of its development, underlying principles of its technique, and challenges presented in widening its adoption with industry.
机译:增材制造彻底改变了产品的设计和制造方式,以涵盖印刷电子领域。用于打印三维(3D)电子和传感器设备的直接写入(DW)技术由于其能够为各种应用提供高性能设备的快速原型制作的能力而经历了惊人的增长。这种增长受到许多因素的驱动,包括大大缩短了设计到产品的交货时间,并在保形和柔性基板上制造了复杂的几何形状。 DW技术最初是由美国国防高级研究计划局(DARPA)的介观集成共形电子(MICE)程序开发的,用于中尺度电子的制造,已经探究了DW技术的广泛应用,包括有源和无源组件,传感器,3D结构以及作为生物学中的应用。本文重点介绍一种新兴的DW方法,即气溶胶喷射印刷(AJP),它是一种使用不同类型的材料在各种表面上印刷精细特征的非接触式方法。气溶胶喷射系统能够在几何形状复杂的基材上印刷各种电子,光学和生物功能材料,这些材料可以是保形,柔性和可拉伸的。气溶胶喷射工艺利用基于溶液或纳米颗粒悬浮液的可印刷油墨,并且可以包括金属,合金,陶瓷,聚合物,粘合剂和/或生物材料。如果油墨与基材兼容,则可以使用多种基材(包括硅,聚酰亚胺,玻璃,FR-4和氧化铝)来印刷这些材料。像其他DW技术一样,AJP工艺提供了无需传统掩模即可制造的独特优势,并且由于在基板上数字定义的位置上选择性沉积了墨水,从而减少了材料消耗。使用这种添加工艺可以消除在减法方法所采用的蚀刻工艺中使用的有害材料的浪费。 AJP系统使用雾化器来产生密集的微滴气雾,这些气雾会聚集成气雾流,在最大隔离高度为5毫米的情况下,产生的沉积物可能是喷嘴开口大小的十分之一。这些功能使制造高度集成的设备的能力从最初的目标中观应用扩展到了微米和纳米规模的应用。使用AJP可以实现更多连接和“智能”产品的设计和创新制造,从而满足当今物联网(IoT)全球市场所需的小型化,灵活和共形的外形尺寸。 AJP技术为生物集成电子产品开辟了新途径,包括电子纺织品,可穿戴电化学系统,电子表皮纹身以及永久性和可溶解的植入式设备。尽管已经证明AJP是可穿戴设备不断发展的领域中的使能技术,但在广泛采用这种创新方法方面仍存在重大挑战。本文提供了AJP技术的概述,并总结了其发展的历史基础,其技术​​的基本原理以及在扩大其被行业采用方面所面临的挑战。

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