首页> 外文会议>ASME Conference on Smart Materials, Adaptive Structures and Intelligent Systems >THE FERROELECTRICITY AND CRYSTALLINITY OF ZIRCONIA, HAFNIAAND HAFNIUM ZIRCONIUM OXIDE (HZO) ULTRATHIN FILMS PREPARED BY ATOMIC LAYER DEPOSITION WITH AND WITHOUT POST-ANNEALING
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THE FERROELECTRICITY AND CRYSTALLINITY OF ZIRCONIA, HAFNIAAND HAFNIUM ZIRCONIUM OXIDE (HZO) ULTRATHIN FILMS PREPARED BY ATOMIC LAYER DEPOSITION WITH AND WITHOUT POST-ANNEALING

机译:氧化锆的铁电性和结晶度,铪亚硝酸铪氧化锆(HZO)通过原子层沉积与且没有后退火的原子层沉积制备的超薄膜

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Large stable ferroelectricity in hafnium zirconium oxide (HZO) solid solution ultrathin films (including pure zirconia (ZrO_2) and hafnia (HfO_2)) and ZrO_2/HfO_2 bilayer ultrathin films of thickness ranging from 5-12 nm, prepared by thermal atomic layer deposition or remote plasma atomic layer deposition (RP-ALD) has been demonstrated. Ferroelectric crystallization of the ZrO_2 ultrathin film with high-pressure orthorhombic (o) space group Pbc2_1 could be achieved without post-annealing due to the plasma-induced thermal stresses experienced by the film during the RP-ALD process. In contrast, for the ZrO_2/HfO_2 bilayer ultrathin film, due to the high crystallization temperature of HfO_2, post-annealing was needed to achieve sufficient confinement of the sandwiched HfO_2 layer by the ZrO_2 top layer and Si bottom substrate to promote the high-pressure ferroelectric o-phase in HfO_2. The ferroelectric properties of the HZO ultrathin films prepared by RP-ALD were highly dependent on the Hf-to-Zr ratio - an increasing amount of HfO_2 has been found to be detrimental to the ferroelectricity, mainly due to the high crystallization temperature of HfO_2. Without post-annealing, the ferroelectricity of the HZO ultrathin films was governed by the relative amounts of the amorphous phase and the ferroelectric o-phase induced by the plasma treatment. While with post-annealing, the ferroelectricity was governed by the relative amounts of the ferroelectric o-phase and the non-ferroelectric monoclinic (m) phase.
机译:在大稳定铁电铪的氧化锆(HZO)固溶超薄通过热原子层沉积制得的薄膜(包括纯的氧化锆(ZrO_2)和二氧化铪(HfO_2))和ZrO_2 / HfO_2双层超薄范围从5-12纳米的厚度的薄膜,或远程等离子体原子层沉积(RP-ALD)已被证明。与Pbc2_1高压斜方晶(O)空间群的ZrO_2超薄膜的强电介质结晶可以在不后退火可以实现由于在RP-ALD过程中由膜所经历的等离子体引起的热应力。与此相反,对于ZrO_2 / HfO_2双层超薄膜,由于HfO_2的高结晶化温度,需要后退火,以实现由ZrO_2顶层和Si底部衬底夹持HfO_2层的足够的约束,以促进高压铁电邻相HfO_2。所述HZO超薄膜的铁电特性制备R​​P-ALD是高度依赖于铪到Zr比例 - 越来越HfO_2的量已经发现是有害的铁电性,主要是由于HfO_2的结晶温度高。如果没有后退火时,HZO超薄膜的铁电是由非晶质相和铁电邻相通过等离子体处理引起的相对量支配。同时用后退火,铁电是由铁电体邻相和非铁电单斜(M)相的相对量支配。

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