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Advanced Packaging and its Characterization for 5G mmWave Antenna in Package

机译:5G mmWave天线封装中的高级封装及其特性

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As the mmWave bands of the 5G become popular and available to the mass market, designing antenna in mmWave transceiver package becomes a popular choice. It is critical that a few key antenna design parameters must be kept in such advanced packaging, including low antenna loss, wide bandwidth matching, and directivity. To achieve these goals, the structure, the material used, and manufacturing process for the advanced packaging, in which antenna is designed in, must be carefully characterized and optimized. In addition, the scalability and the cost of the advanced packaging used for 5G mmWave have to meet the market demands.
机译:随着5G的mmWave频段变得流行并投入大众市场,以mmWave收发器封装设计天线已成为一种流行的选择。至关重要的是,必须在这种高级封装中保留一些关键的天线设计参数,包括低天线损耗,宽带宽匹配和方向性。为了实现这些目标,必须仔细设计和优化用于设计天线的高级包装的结构,材料和制造工艺。此外,用于5G mmWave的高级封装的可扩展性和成本必须满足市场需求。

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