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A Ka-Band Stacked Power Amplifier with 24.8-dBm Output Power and 24.3 PAE in 65-nm CMOS Technology

机译:具有65纳米CMOS技术的24.8 dBm输出功率和24.3%PAE的Ka波段堆叠式功率放大器

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This paper presents a fully integrated one-stage three-stack Ka-band power amplifier (PA) with neutralization technique in 65-nm CMOS process for 5G applications. A transformer-based power combiner is adopted to combine two differential PA cells to increase the output power. Four small size stacked sets are combined together as one differential PA cell for increasing efficiency. A shunt feedback drain-source capacitor is utilized to divide the output voltage equally between drain and source of each individual transistor in three-stack PA. The proposed PA achieves the measured saturated output power (Psat) of 24.8 dBm with 24.3% peak power added efficiency (PAE), output 1-dB compression point (OP1dB) of 21.7 dBm and 17.5-dB power gain at 38 GHz. The chip size without pads is 0.146 mm2. To the author's best knowledge, this stacked PA demonstrates the best power performance compared with the reported CMOS PAs around 38 GHz.
机译:本文介绍了采用中和技术的完全集成的单级三堆叠Ka频段功率放大器(PA),该技术在5nm CMOS工艺中适用于5G应用。采用基于变压器的功率合并器将两个差分PA单元合并以增加输出功率。四个小尺寸堆叠组组合在一起,成为一个差分PA电池,以提高效率。利用并联反馈漏极-源极电容器在三叠式PA中的每个晶体管的漏极和源极之间均分输出电压。拟议的功率放大器实现了测得的饱和输出功率(P sat )为24.8 dBm,峰值功率附加效率(PAE)为24.3%,输出为1-dB压缩点(OP 1dB )在38 GHz时为21.7 dBm和17.5 dB的功率增益。不带焊盘的芯片尺寸为0.146毫米 2 。据作者所知,与报道的38 GHz左右的CMOS PA相比,这种堆叠式PA具有最佳的功率性能。

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