首页> 外文会议>IEEE MTT-S International Microwave Symposium >185mW InP HBT Power Amplifier with 1 Octave Bandwidth (2550GHz), 38 peak PAE at 44GHz and Chip Area of 276 x 672 μm2
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185mW InP HBT Power Amplifier with 1 Octave Bandwidth (2550GHz), 38 peak PAE at 44GHz and Chip Area of 276 x 672 μm2

机译:具有1个倍频带宽(2550GHz)的185mW InP HBT功率放大器,在44GHz时峰值PAE为38%,芯片面积为276 x 672μm 2

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We report a 250 nm InP HBT MMIC that demonstrates record output power at 44 GHz for its chip size, having a small signal bandwidth of 25 - 50 GHz, and operating from a 2.5-2.8 V supply. The reported power amplifier delivers up to 185 mW and has a peak PAE of 38% at 44 GHz. The results in this work highlight the relevance of 250 nm InP HBT devices for emerging size-constrained platforms including MIMO communication front-ends and radar applications.
机译:我们报告了一个250 nm InP HBT MMIC,该芯片尺寸证明其记录功率为44 GHz,具有25-50 GHz的小信号带宽,并采用2.5-2.8 V电源供电。报道的功率放大器提供高达185 mW的功率,在44 GHz时的峰值PAE为38%。这项工作的结果突出了250 nm InP HBT器件与新兴的尺寸受限平台(包括MIMO通信前端和雷达应用)的相关性。

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