A novel power semiconductor module platform for the automotive powertrain is presented in this paper. Mold modules are designed for symmetric and minimized parasitics by applying alternating and multilayer current routing. All interconnects are solder-free to provide superior reliability, and to meet present and future automotive requirements, e.g., passing 1000 temperature shock cycles in the range of -40 to 150 deg C. SiC or Si devices are packaged in the same external outline offering a simple scalability for inverter classes in the 150 - 350 kW power range. A screw-less and O-ring-less 3-phase inverter module is achieved by a laser welding of the mold modules to a low-cost Al cooler enclosure.
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