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Fermi Level Unpinning of GaSb(100) using Plasma Enhanced ALD Al_2O_3 Dielectric

机译:使用等离子体增强型AL_2O_3电介质,FERMI水平造成汽油(100)的销量

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Antimonide based compound semiconductors have gained considerable interest in recent years due to their superior electron and hole transport properties [1-3]. Among the various high mobility material systems (Fig. 1), arsenic-antimonide based MOS-HEMTs have great potential to enable complementary logic operation at low supply voltage. Integrating a high quality dielectric is key to demonstrating a scalable arsenic-antimonide MOS-HEMT architecture for 15 nm logic technology node and beyond. It is hypothesized that an ultra-thin GaSb surface layer is more favorable toward high-κ integration than In_(0.2)Al_(0.8)Sb barrier as it avoids Al at the interface and the associated surface oxidation. Here, we study the effects of various surface passivation approaches on the capacitance-voltage characteristics (C-V) and the surface chemistry of n-type and p-type GaSb(100) MOS capacitors made with ALD and Plasma Enhanced ALD (PEALD) Al_2O_3 dielectric. We demonstrate for the first time, unpinned Fermi level in GaSb MOS system with high-κ PEALD Al_2O_3 dielectric using admittance spectroscopy and XPS analysis. N-type and p-type GaSb (100) wafers were degreased in acetone and IPA. For some samples HCl etch was used to remove surface oxide and a dilute ammonium sulfide solution was used to passivate the surface. GaSb MOS capacitors were fabricated with Al_2O_3 deposited by ALD at 300°C from trimethylaluminum (TMA) and water or by PEALD at 200°C from TMA and CO_2. PEALD was employed to reduce the thermal budget of dielectric deposition, particularly important for antimonide semiconductors [4]. Fig. 2 shows the C-V measurements on the n-type ALD Al_2O_3-GaSb MOS capacitors. The control sample without surface preparation showed a pinned Fermi level, and the HCl and ammonium sulfide treated ALD samples showed weakly pinned C-V characteristics with very fast interface trap (D_(it)) response. Fig. 3 shows C-V and G-V (conductance) characteristics of the n-type PEALD samples which shows very good Fermi level modulation. The accumulation side of the admittance data was analyzed using the standard depletion/accumulation model and the inversion side using the model shown in Fig. 4(a) [5]. The circuit model in inversion accounts for the supply of minority carriers along with interface state contribution which enables accurate modeling of the admittance data in weak inversion. The modeled data and extracted quasi-static C-V corrected for D_(it) are also shown in Fig. 3 which is in good agreement with the measured data. Fig. 4(b) shows the Arrhenius plot of the minority carrier (hole) conductance in the n-type PEALD sample which gives an activation energy of 0.1eV. This is much less than the activation energy for SRH generation through mid-level traps in the depletion region (Eg/2=0.36 eV). It could be possible the second ionization level of the native acceptor defects (at 0.1 eV from valence band due to Ga vacancies and antisite defects [6]) is supplying the minority carriers for inversion.
机译:近年来,抗衍生基的复合半导体近年来较高的电子和空穴传输性能[1-3]。在各种高迁移率材料系统(图1)中,基于砷锑苷的MOS-HEMT具有很大的潜力,可以在低电源电压下实现互补逻辑操作。集成高质量的电介质是用于演示可扩展的砷 - 锑ide MOS-HEMT架构的关键,用于15nm逻辑技术节点及更远。假设超薄气体表面层比在界面和相关表面氧化的避免Al避免Al的高κ1(0.2)AL_(0.2)AL_(0.8)AL_(0.8)SB屏障上更有利。在这里,我们研究了用ALD和等离子增强型ALD(PEALD)AL_2O_3电介质的N型和P型气体(100)MOS电容器对电容 - 电压特性(CV)和表面化学的各种表面钝化方法的影响。 。我们首次展示了具有高κPEALD AL_2O_3电介质的GASB MOS系统中的不净化费米水平,使用进入光谱和XPS分析。在丙酮和IPA中脱脂N型和P型气体(100)晶片。对于一些样品,HCl蚀刻用于除去表面氧化物,并使用稀硫铵溶液钝化表面。通过在300℃下由三甲基铝(TMA)和水沉积的Al_2O_3,或通过来自TMA和CO_2的200℃的PEALD制备Gasb MOS电容器。采用PEALD以降低介电沉积的热预算,对抗衍生物半导体特别重要[4]。图。图2示出了N型ALD AL_2O_3-GASB MOS电容器上的C-V测量。没有表面制剂的对照样品显示出固定的费米水平,HCl和硫化氢处理的ALD样品呈弱循环的C-V特性,具有非常快的界面阱(D_(IT))响应。图。图3显示了N型PEALD样品的C-V和G-V(电导)特征,其显示出非常好的费米水平调制。使用标准耗尽/累积模型和使用图4(a)[5]所示的模型来分析导纳数据的累积侧。4(a)[5]。反演中的电路模型考虑了少数竞争因素以及接口状态贡献,这使得能够在弱反转中准确建模进入数据。对D_(IT)的建模数据和提取的准静态C-V也在图4中示出,与测量数据很好。图。图4(b)示出了N型PEALD样品中的少数载体(孔)电导的ARHENIUS图,其给出了0.1EV的激活能量。这比通过耗尽区域中的中级陷阱(例如/ 2 = 0.36eV​​)的中级陷阱产生的SRH生成的激活能量小于。它可以是天然受体缺陷的第二电离水平(由于GA空位引起的价管和抗烧伤缺陷来自价带中的0.1eV [6])正在供应少数载体进行反转。

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