Millimeter-wave silicon-based micro-machined SIW filters design for System-in-package

摘要

The substrate integrated waveguide (SIW) technology is adopted to implement high-performance and self-package millimeter-wave filters on silicon substrate in this paper. The Ka-band fourth-order chebyshev filters and a dual-mode filter are designed and optimized using classic filter synthesis method and full-wave simulator to meet the millimeter-wave system-in-package (SiP) requirement, and the designed SIW filters are fabricated on 400 um high-resistivity silicon (HR-Si) substrate using bulk micro-maching process. The measured results of these filters exhibit low insertion loss in passband and good frequency selectivity in compact size, agree well with simulation results.