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An Efficient and Low-Overhead Chip-to-Chip Interconnect Protocol Design for NOC

机译:一种高效,低开销的NOC芯片间互连协议设计

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As the scale of the multicore system expands, it may extend to multiple chips with chip-to-chip interconnect, and its data transmission needs to be fast and efficient. Network on chips (NOCs) has become the mainstream structure for distributed multicore connections, while there are few inter-chip protocols for NOC. In this paper, a highly efficient and low-overhead chip-to-chip interconnect protocol design for NOC is proposed, which consists of data link layer, physical layer and flow control mechanism design. By using ZCU102 evaluation kit, we validate our protocol design with various dataflow, achieving up to 10 Gb/s/lane line rate.
机译:随着多核系统规模的扩大,它可能会扩展到具有芯片间互连的多个芯片,并且其数据传输需要快速高效。片上网络(NOC)已成为分布式多核连接的主流结构,而NOC的片间协议则很少。本文提出了一种高效,低开销的NOC芯片到芯片互连协议设计,它由数据链路层,物理层和流控制机制设计组成。通过使用ZCU102评估套件,我们通过各种数据流验证了我们的协议设计,从而实现了高达10 Gb / s / lane的线路速率。

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