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An Efficient and Low-Overhead Chip-to-Chip Interconnect Protocol Design for NOC

机译:NOC的高效且低开销芯片对片互连协议设计

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As the scale of the multicore system expands, it may extend to multiple chips with chip-to-chip interconnect, and its data transmission needs to be fast and efficient. Network on chips (NOCs) has become the mainstream structure for distributed multicore connections, while there are few inter-chip protocols for NOC. In this paper, a highly efficient and low-overhead chip-to-chip interconnect protocol design for NOC is proposed, which consists of data link layer, physical layer and flow control mechanism design. By using ZCU102 evaluation kit, we validate our protocol design with various dataflow, achieving up to 10 Gb/s/lane line rate.
机译:随着多核系统的规模展开,它可能延伸到具有芯片到芯片互连的多个芯片,并且其数据传输需要快速高效。芯片上的网络(NOC)已成为分布式多核连接的主流结构,而NOC则几个片段协议。在本文中,提出了一种高效且低开销的NOC芯片互连协议设计,包括数据链路层,物理层和流量控制机构设计。通过使用ZCU102评估套件,我们使用各种数据流验证我们的协议设计,可实现高达10 GB / S /车道的线速率。

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