High-Resolution Structural Analysis of Multilayer Package Substrate with Open-Source Parallel FE Software FrontISTR

摘要

For precisely predicting the thermal warpage of IC package substrates, we have performed high-resolution and large-scale finite element analyses by using an open-source structural analysis software, FrontISTR. It is found that the thermal warpage converges when the resolution of finite element mesh becomes less than the typical trace width on the package substrate. Also, the FrontISTR parallel performance for analyzing nonlinear warpage has been demonstrated on a PC cluster with 96 cores.