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A 28-GHz-band Stacked FET Linear Power Amplifier IC with 36.2 PAE at 3-dB back-off from P1dB in 56-nm SOI CMOS

机译:28 GHz频段堆叠式FET线性功率放大器IC,在56 nm SOI CMOS中具有36.2%的PAE,从P1dB退回3dB

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This paper presents a high efficiency linear stacked FET power amplifier (PA) IC for 5G wireless communication systems. An adaptive bias circuit is used to enhance linearity and back-off efficiency. In addition, third-order trans-conductance component (gm3) is cancelled by multi-cascode structure. The PA IC is designed, fabricated and fully evaluated in 56-nm SOI CMOS. At a supply voltage of 4 V, the PA IC has exhibited an output power of 20.0 dBm and a PAE of 38.1% at 1-dB gain compression point (P1dB). The PAEs at 3 dB and 6 dB back-off from P1dB are 36.2 % and 28.7 %, respectively. The output IP3 of 25.0 dBm is obtained.
机译:本文提出了一种适用于5G无线通信系统的高效线性堆叠FET功率放大器(PA)IC。自适应偏置电路用于增强线性度和补偿效率。另外,三阶跨导分量(g m 3)被多级联结构取消。 PA IC是在56nm SOI CMOS中进行设计,制造和全面评估的。在4 V的电源电压下,PA IC在1 dB增益压缩点(P1dB)时表现出20.0 dBm的输出功率和38.1%的PAE。从P1dB退回3 dB和6 dB时的PAE分别为36.2%和28.7%。获得25.0 dBm的输出IP3。

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