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Design of Polysilicon-Gate DDSCR Device For RF Chip’s ESD Protection Based on 0.18μm BCD Process

机译:基于0.18μmBCD工艺的RF芯片ESD保护用多晶硅栅DDSCR器件设计

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摘要

A polysilicon-gate dual direction silicon-controlled rectifier device (PGDDSCR) is proposed for the research of on-chip integrated protection of RF communication system with dual direction SCR. It is validated using the 0.18-μm standard BCD(BiCMOS/CMOS/DMOS) process and is used for electrostatic discharge (ESD) protection of RF communications. The HBM level of the device is estimated based on the results of the transmission line pulse test. The human body model (HBM) of the PGDDSCR device is 4.5 KV, the breakdown voltage and the failure current are 21.1 V and 3 A, respectively. Due to the short-circuiting of the polysilicon gate of the anode (cathode), the PGDDSCR device generates an electric field effect to promote the positive feedback effect of the SCR, achieving the level of protection required by the target system. And because the area of the ESD device is small, the parasitic capacitance present does not affect the signal integrity of the RF communication system.
机译:为了研究双向可控硅射频通信系统的片上集成保护,提出了一种多晶硅栅双向可控硅整流器(PGDDSCR)。它已通过0.18μm标准BCD(BiCMOS / CMOS / DMOS)工艺进行了验证,并用于RF通信的静电放电(ESD)保护。根据传输线脉冲测试的结果估算设备的HBM级别。 PGD​​DSCR器件的人体模型(HBM)为4.5 KV,击穿电压和故障电流分别为21.1 V和3A。由于阳极(阴极)的多晶硅栅极短路,PGDDSCR器件会产生电场效应,以增强SCR的正反馈效应,从而达到目标系统所需的保护水平。并且由于ESD器件的面积很小,因此存在的寄生电容不会影响RF通信系统的信号完整性。

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