首页> 外文会议>International Symposium on VLSI Technology, Systems and Application >Contradiction Behaviors between I-V and C-V Curves after Self-Heating Stress in a-IGZO TFT with Triple-Stacked Channel Layers
【24h】

Contradiction Behaviors between I-V and C-V Curves after Self-Heating Stress in a-IGZO TFT with Triple-Stacked Channel Layers

机译:具有三层堆叠沟道层的a-IGZO TFT自热应力后I-V和C-V曲线之间的矛盾行为

获取原文

摘要

In this work, an opposite sub-threshold swing trend of I-curve to C-V curve in tri-layer IGZO TFT is observed. Thermal and electrical field effects during stress duration is investigated to clarify this behavior. Results indicate a carrier distribution migration phenomenon; carriers are away from the gate insulator surface after self-heating stress which is caused by defect generations at channel/GI interface. Since carrier tends to locate at the middle layer (In-rich layer) after self-heating stress, carriers away from surface defects leads to a better subthreshold swing in I-V curve. However, C-V curves detects the information of defects leading to S.S degradation.
机译:在这项工作中,在三层IGZO TFT中观察到了I曲线与C-V曲线相反的亚阈值摆动趋势。研究了应力持续期间的热和电场效应,以阐明此行为。结果表明载流子分布迁移现象。由于通道/ GI界面处产生缺陷而产生自热应力后,载流子远离栅极绝缘体表面。由于载流子倾向于在自热应力后位于中间层(富In层),因此远离表面缺陷的载流子会导致I-V曲线的亚阈值摆幅更好。但是,C-V曲线会检测导致S.S退化的缺陷信息。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号