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Unraveling the role of photons and electrons upon their chemical interaction with photoresist during EUV exposure

机译:揭示光子和电子在EUV曝光过程中与光致抗蚀剂发生化学相互作用时的作用

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The interaction of 91.6 eV EUV photons with photoresist - in particular chemically amplified resist (CAR) - is different than exposure at 193 nm and 248 nm wavelengths. The latter is understood well and it is known that photons interact with electrons in the resist's molecular valence orbitals (for chemically amplified resist (CAR) the photon interacts with the photo acid generator (PAG), which leads to a deprotection reaction on a polymer after a thermal catalytic reaction during a post-exposure-bake.). At EUV however, more steps are involved in the radiolysis process between the absorption of the photon and the final chemical modification. These are related to the generation of primary electrons and their decay to lower energy secondary electrons, and most of this steps are not well understood. In this paper, the reaction products from EUV and low energy electron exposure are examined using Residual Gas Analysis (RGA), which measures and analyzes the outgassing products related to the ongoing reactions. This investigation is applied firstly on a model CAR where details of the resist chemical constituents were known prior to testing. The measurement not only resolved information on the expected acid related reactions from the PAG and protection groups, but also exhibited direct scission reactions of the polymer, where some of them lead to polymerization reactions. Moreover, the measurement quantifies the balance between the different ongoing reactions, which were confirmed by contrast curve measurements. Based on learnings on the model resist, applied the measurement technique to commercial resists, where actual resist chemistry composition is not known. Despite that, it was found that information could be deduced to distinguish between acid related ongoing reactions and direct scission of reaction on the base polymer and quantify their relation. Moreover, different generations of commercial resists based on similar chemistry platform were investigated, which revealed that improvements in printing performance could be explained by PAG reaction yield increase.
机译:91.6 eV EUV光子与光致抗蚀剂(特别是化学放大抗蚀剂(CAR))的相互作用不同于在193 nm和248 nm波长下的曝光。后者很容易理解,并且众所周知,光子会与抗蚀剂分子价轨道中的电子相互作用(对于化学放大的抗蚀剂(CAR),光子会与光酸产生剂(PAG)相互作用,这会导致聚合物在脱保护后发生脱保护反应曝光后烘烤期间的热催化反应。)但是,在EUV,在光解吸收和最终化学修饰之间的辐射分解过程涉及更多步骤。这些与一次电子的产生以及它们向低能二次电子的衰变有关,并且其中的大多数步骤都不太清楚。在本文中,使用残留气体分析(RGA)检查了EUV和低能电子暴露的反应产物,该残留气体分析可测量和分析与正在进行的反应相关的除气产物。首先在模型CAR上进行此研究,在测试之前先了解抗蚀剂化学成分的详细信息。该测量不仅解析了来自PAG和保护基的预期的酸相关反应的信息,而且还显示了聚合物的直接断裂反应,其中一些导致聚合反应。此外,该测量量化了不同正在进行的反应之间的平衡,这通过对比曲线测量得到了证实。根据对模型抗蚀剂的了解,将测量技术应用于实际抗蚀剂化学成分未知的商业抗蚀剂。尽管如此,发现可以推断出信息以区分与酸相关的正在进行的反应和在基础聚合物上直接分裂反应并量化它们之间的关系。此外,研究了基于类似化学平台的不同代号的商业抗蚀剂,这表明可以通过PAG反应收率的提高来解释印刷性能的提高。

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