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Through-focus scanning optical microscopy (TSOM) with adaptive optics

机译:具有自适应光学元件的全焦点扫描光学显微镜(TSOM)

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Through-focus optical microscopy (TSOM) with nanometer-scale lateral and vertical sensitivity levels matching those of scanning electron microscopy has been demonstrated to be useful both for 3D inspections and metrology assessments. In 2014, funded by two private companies (Nextin/Samsung Electronics) and the Korea Evaluation Institute of Industrial Technology (KEIT), a research team from four universities in South Korea set out to investigate core technologies for developing in-line TSOM inspection and metrology tools, with the respective teams focusing on optics implementation, defect inspection, computer simulation and high-speed metrology matching. We initially confirmed the reported validity of the TSOM operation through a computer simulation, after which we implemented the TSOM operation by through-focus scanning of existing UV (355nm) and IR (800nm) inspection tools. These tools have an identical sampling distance of 150 nm but have different resolving distances (310 and 810 nm. respectively). We initially experienced some improvement in the defect inspection sensitivity level over TSV (through-silicon via) samples with ~ 6.6μm diameters. However, during the experiment, we noted sensitivity and instability issues when attempting to acquire TSOM images. As TSOM 3D information is indirectly extracted by differentiating a target TSOM image from reference TSOM images, any instability or mismatch in imaging conditions can result in measurement errors. As a remedy to such a situation, we proposed the application of adaptive optics to the TSOM operation and developed a closed-loop system with a tip/tilt mirror and a Shack-Hartmann sensor on an optical bench. We were able to keep the plane position within in RMS 0.4 pixel by actively compensating for any position instability which arose during the TSOM scanning process along the optical axis. Currently, we are also developing another TSOM tool with a deformable mirror instead of a tip/tilt mirror, in which case we will not require any mechanical scanning.
机译:具有与扫描电子显微镜相匹配的纳米级横向和垂直灵敏度水平的全焦点光学显微镜(TSOM)已被证明可用于3D检查和计量评估。 2014年,由两家私营公司(Nextin /三星电子)和韩国工业技术评估研究所(KEIT)资助,来自韩国四所大学的研究团队着手研究开发在线TSOM检测和计量学的核心技术工具,各自的团队专注于光学实现,缺陷检查,计算机仿真和高速计量匹配。我们最初通过计算机仿真确认了报告的TSOM操作的有效性,此后,我们通过对现有的UV(355nm)和IR(800nm)检查工具进行了焦点扫描来实现了TSOM操作。这些工具具有相同的150 nm采样距离,但具有不同的分辨距离(分别为310和810 nm)。最初,我们对直径约为6.6μm的TSV(硅通孔)样品的缺陷检测灵敏度进行了一定程度的改进。但是,在实验期间,我们在尝试获取TSOM图像时注意到了灵敏度和不稳定性问题。由于通过将目标TSOM图像与参考TSOM图像区分开来间接提取TSOM 3D信息,因此成像条件的任何不稳定性或不匹配都会导致测量误差。为了解决这种情况,我们建议将自适应光学元件应用到TSOM操作中,并开发了一个在光具座上带有尖端/倾斜镜和Shack-Hartmann传感器的闭环系统。通过主动补偿在沿光轴的TSOM扫描过程中出现的任何位置不稳定性,我们能够将平面位置保持在RMS 0.4像素以内。当前,我们还在开发另一种具有可变形镜面而不是倾斜/倾斜镜面的TSOM工具,在这种情况下,我们将不需要任何机械扫描。

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