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Power Supply Noise Coupling Mitigation across High Speed Serial Links

机译:跨高速串行链路的电源噪声耦合缓解

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In the SoC (System on Chip) environment, one I/O will have power supply noise coupling from other I/Os due to the proximity of different I/O's noise source and lack of mitigation mechanisms at the victim. It becomes more important if the victim I/O is very sensitive to certain noise spectrum. This paper describes a methodical approach for characterizing the Power delivery network coupling from one I/O to the other I/O & also provides solution to reduce this coupling noise which is validated across different Silicon. Early identification of such coupling mechanisms is very important, as the necessary mechanisms to mitigate the coupling can be implemented in the SoC development phase.
机译:在SoC(片上系统)环境中,一个I / O的电源噪声会与其他I / O耦合,这是由于不同I / O噪声源的距离很近,并且受害人缺乏缓解机制。如果受害I / O对某些噪声频谱非常敏感,这将变得更加重要。本文介绍了一种表征从一个I / O到另一个I / O的电源传输网络耦合特性的方法,并提供了减少耦合噪声的解决方案,该解决方案已在不同的硅片上得到验证。尽早识别这种耦合机制非常重要,因为可以在SoC开发阶段实现减轻耦合的必要机制。

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