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Multifunctional MMICs – Key Enabler for Future AESA Panel Arrays

机译:多功能MMIC –未来AESA面板阵列的关键推动力

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Central building blocks for modern phased arrays with Active Electronically Steered Antennas (AESA) are single channel Transmit/Receive (T/R) modules, used in different platforms today, e.g., in antennas for ground surveillance and security radar or in airborne fighter nose radars. Up to hundreds of T/R Modules (TRM) are mounted on so called “plank structures” and with an arrangement of planks the aperture geometry of the AESA is realised perpendicular to the plank direction. Up to now, the receive-, transmit- and control functions of the TRMs typically are realized with single-function GaAs- and Si- MMICs (Monolithic Microwave Integrated Circuit). In order to provide a considerable grating lobe free field of view these brick-style TRMs must fit the half-wavelength grid demand. Therefore the final module width for X-Band usually is limited to 15mm (max). New AESA equipment for UAVs (Unmanned Aerial Vehicles) will have to be integrated in even smaller volumes and often have to match with extremely small hardware-volume and geometry factors, especially with regard to installation depth. Within the last years the development of semiconductor technologies like GaN (Gallium Nitride) and SiGe (Silicon Germanium) have shown a high potential for compact RF solutions by combining several functionalities in one MMIC. HENSOLDT has developed GaN based frontend MMICs including LNA (Low Noise Amplifier), HPA (High Power Amplifier) and SWITCH (replacing the circulator) functionality and SiGe based CoreChips providing both phase- and amplitude setting of the RF signal and control/command and memory functions. With these two multifunctional MMICs and appropriate packaging technologies, the development of a new generation of AESA panel arrays based on tile architecture is rendered possible. Herein the single T/R channels form part of a 3D T/R active zone embedded in an RF multilayer board with the radiating element on its top layer. This modern tile array approach will allow flat antenna solutions with a drastically reduced installation depth.
机译:具有有源电子转向天线(AESA)的现代相控阵的核心构建模块是单通道发送/接收(T / R)模块,如今已在各种平台中使用,例如,用于地面监视和安全雷达的天线或机载战斗机头雷达。多达数百个T / R模块(TRM)安装在所谓的“木板结构”上,并且通过布置木板,AESA的孔径几何形状垂直于木板方向实现。到目前为止,TRM的接收,发送和控制功能通常是通过单功能GaAs和Si-MMIC(单片微波集成电路)实现的。为了提供相当大的无光栅波瓣的视场,这些砖型TRM必须适合半波长网格的需求。因此,X波段的最终模块宽度通常限制为15mm(最大)。用于无人机(无人机)的新型AESA设备将不得不集成到更小的体积中,并且通常必须匹配极小的硬件体积和几何尺寸因素,尤其是在安装深度方面。在过去的几年中,诸如GaN(氮化镓)和SiGe(硅锗)之类的半导体技术的发展通过将多个功能组合到一个MMIC中,显示出了紧凑型RF解决方案的巨大潜力。 HENSOLDT已经开发了基于GaN的前端MMIC,包括LNA(低噪声放大器),HPA(高功率放大器)和SWITCH(替代循环器)功能,以及基于SiGe的CoreChips,可提供RF信号的相位和幅度设置以及控制/命令和存储器。功能。借助这两种多功能MMIC和适当的封装技术,基于瓷砖架构的新一代AESA面板阵列的开发成为可能。这里,单个T / R通道形成嵌入在RF多层板中的3D T / R有源区的一部分,其中辐射元件在其顶层上。这种现代的瓦片阵列方法将使平板天线解决方案的安装深度大大降低。

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