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Multifunctional MMICs – Key Enabler for Future AESA Panel Arrays

机译:多功能MMICS - 未来AESA面板阵列的键推动器

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Central building blocks for modern phased arrays with Active Electronically Steered Antennas (AESA) are single channel Transmit/Receive (T/R) modules, used in different platforms today, e.g., in antennas for ground surveillance and security radar or in airborne fighter nose radars. Up to hundreds of T/R Modules (TRM) are mounted on so called “plank structures” and with an arrangement of planks the aperture geometry of the AESA is realised perpendicular to the plank direction. Up to now, the receive-, transmit- and control functions of the TRMs typically are realized with single-function GaAs- and Si- MMICs (Monolithic Microwave Integrated Circuit). In order to provide a considerable grating lobe free field of view these brick-style TRMs must fit the half-wavelength grid demand. Therefore the final module width for X-Band usually is limited to 15mm (max). New AESA equipment for UAVs (Unmanned Aerial Vehicles) will have to be integrated in even smaller volumes and often have to match with extremely small hardware-volume and geometry factors, especially with regard to installation depth. Within the last years the development of semiconductor technologies like GaN (Gallium Nitride) and SiGe (Silicon Germanium) have shown a high potential for compact RF solutions by combining several functionalities in one MMIC. HENSOLDT has developed GaN based frontend MMICs including LNA (Low Noise Amplifier), HPA (High Power Amplifier) and SWITCH (replacing the circulator) functionality and SiGe based CoreChips providing both phase- and amplitude setting of the RF signal and control/command and memory functions. With these two multifunctional MMICs and appropriate packaging technologies, the development of a new generation of AESA panel arrays based on tile architecture is rendered possible. Herein the single T/R channels form part of a 3D T/R active zone embedded in an RF multilayer board with the radiating element on its top layer. This modern tile array approach will allow flat antenna solutions with a drastically reduced installation depth.
机译:用于Active电子操纵的天线(AESA)现代相控阵中央构建块是单个信道发送/接收(T / R)模块,在不同的平台上使用的今天,例如,在天线为地面监视和安全雷达或在机载战斗机鼻子雷达。多达几百T / R模块(TRM)的被安装在所谓的“板结构”,并与AESA的孔的几何形状在垂直于板的方向实现厚板的布置。到现在为止,在接收 - ,发射 - 和典型地实现了单功能GaAs-键和Si-的MMIC(单片微波集成电路)的真有效值的控制功能。为了提供一个相当大的栅瓣自由场的看法,这些砖风格的真有效值必须符合半波长电网需求。因此,对于X波段的最终模块宽度通常被限制至15mm(最大)。新装备AESA无人机(无人机)将必须被集成在更小的体积,往往要配合极小的硬件容量和几何形状的因素,尤其是在安装深度。在过去几年内,半导体技术,如氮化镓(氮化镓)和SiGe(硅锗)的发展已经由几个功能于一体MMIC组合显示为紧凑型射频解决方案的高潜力。亨索尔特具有基于氮化镓发达前端的MMIC包括LNA(低噪声放大器),HPA(高功率放大器)和开关(代替循环器)的功能和SiGe基于CoreChips同时提供相位和RF信号和控制/命令和存储器的幅度设置职能。有了这两个多官能的MMIC和适当的封装技术,新一代基于瓦片架构AESA面板阵列的发展成为可能。本文中的单T / R信道形成嵌入在RF多层基板,其顶部层上的辐射元件的3D T / R有源区的一部分。这种现代瓦片阵列方法将允许以大幅降低的安装深度平面天线的解决方案。

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