REDUCING SPATTER IN FLUX CORED SOLDER WIRES FOR ROBOTIC SOLDERING APPLICATIONS

摘要

Robotic soldering systems are rapidly surpassing manual processes in both first pass and rework soldering of electronic assemblies due to greatly improved process control and lower costs. However, this advanced approach requires tighter specifications of the cored wire and improved production consistency. The wire and soldering process also need to be specifically engineered to meet the more demanding throughput requirements of this technology. Mitigating solder ball spatter is one of the most critical requirements, as advanced robotic soldering applications cannot tolerate the associated reliability concerns. Solder ball spatter of greater than 200μm can potentially cause bridging of fine pitch devices. A Design of Experiments (DOE) structure was used to optimize numerous process variables, which, along with flux optimization, translates into maximized reliability performance in customer applications.