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Self-healing Properties of Metalized Polypropylene Film with Elevated Sheet Resistance

机译:具有升高的薄层电阻的金属化聚丙烯薄膜的自愈性能

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Metalized polypropylene films are widely used as dielectric materials in self-healing (SH) power capacitors due to its higher operation electric field, and the SH properties of metalized film directly decided the performance of capacitors. Among all the film parameters, the effects of sheet resistance ($R_{mathrm{s}}$, the ratio of metal resistivity $ho$ to metal thickness $d, R_{mathrm{s}}=ho/d$) played the dominant role, that the higher $R_{mathrm{s}}$ usually resulted in the better SH performance. As a result, in the present study the SH properties of metalized polypropylene film with elevated $R_{mathrm{s}}$ were investigated. The morphology of evaporated area of sample films were observed, and four parameters, the dissipated energy ($W_{ext{sh}}$), the evaporation area ($S_{mathrm{v}}$), the peak value of short circuit current ($I_{mathrm{m}}$) and the duration time ($au$) were selected to characterize the SH performance. Results showed that electric explosion was more likely to happen during SH process when $R_{mathrm{s}}$ was higher than $35 mathrm{Omega}$, which might threaten the stable operation of capacitors. Besides, $W_{ext{sh}}, S_{mathrm{v}}, I_{mathrm{m}}$ and $au$ all decreased with the increase of $R_{mathrm{s}}$, benefiting the SH process, but the benefits reduced at high $R_{mathrm{s}}$ level. Considering the higher dielectric losses and financial costs brought by the elevated $R_{mathrm{s}}$, an appropriate $R_{mathrm{s}}$ of $35 mathrm{Omega}$ was recommended.
机译:金属化聚丙烯薄膜被广泛地在自愈合(SH)电力电容器用作介电材料由于其较高的操作电场,和金属化膜的性能SH直接决定电容器的性能。在所有的膜参数,薄片电阻的影响( $ R _ { mathrm {S }} $ 金属的电阻率的比 $ rho $ 到金属厚度 $ d,R _ { mathrm {S}} = RHO / d $ )发挥了主导作用,越高 $ R _ { mathrm {S }} $ 通常导致更好的性能SH。其结果是,在本研究中具有升高的金属化聚丙烯薄膜的特性SH $ R _ { mathrm {S }} $ 被调查了。样品薄膜的蒸发面积的形态进行观察,和四个参数,所述能量耗散( $ W _ {文本{SH }} $ ),蒸发面积( $ S _ { mathrm {V }} $ ),短路电流的峰值( $ I _ { mathrm {米}} $ )和持续时间( $ tau蛋白$ )被选择以表征SH性能。结果表明,电动爆炸更可能在SH过程时发生 $ R _ { mathrm {S }} $ 明显高于 $ 35 mathrm {欧米茄} $ 可能会威胁电容的稳定运行。除了, $ W _ {文本{SH }}, S _ { mathrm {v}},我_ { mathrm {M}} $ $ tau蛋白$ 所有的增加而降低 $ R _ { mathrm {S }} $ ,惠及SH过程,但收益高降低 $ R _ { mathrm {S }} $ 等级。考虑到较高的介电损耗和高架带来的财务费用 $ R _ { mathrm {S }} $ ,适当的 $ R _ { mathrm {S }} $ $ 35 mathrm {欧米茄} $ 建议。

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