首页> 外文会议>IEEE/ACM International Conference on Computer-Aided Design >Mixed-cell-height detailed placement considering complex minimum-implant-area constraints
【24h】

Mixed-cell-height detailed placement considering complex minimum-implant-area constraints

机译:考虑复杂的最小植入面积限制的混合单元高度详细放置

获取原文

摘要

Mixed-cell-height circuits have prevailed in advanced technology to address various design needs. Along with device scaling, complex minimum-implant-area (MIA) constraints arise as an emerging challenge in modern circuit designs, adding to the difficulties in mixed-cell-height placement. Existing MIA-aware detailed placement with single-row-height standard cells is insufficient for mixed-cell-height designs: (1) filler insertion, typically used to resolve MIA violations, might incur unaffordable area and wirelength overheads, and (2) mixed-height cell perturbation could cause severe inter-row MIA violations. This paper presents the first work to address the mixed-cell-height detailed placement problem considering both intra- and inter-row MIA constraints. We first fix intra-row violations by clustering violating mixed-height cells of the same threshold voltage, and then perturb each cluster to obtain a desired cell permutation by applying an efficient, optimal dynamic-programming-based algorithm for a special case and Algorithm DLX for general ones, where a provably constant performance ratio for a mixed-cell-height reshaping problem can be achieved. With a network-flow-based formulation, remaining violating cells are placed in appropriate filler-insertion positions to fix cell violations and minimize area. After performing mixed-cell-height detailed placement, we finally fix inter-row violations by shifting violating cells in minimum displacement. Compared with a filler insertion method and a greedy clustering approach, experimental results show that our proposed algorithm can resolve all MIA violations with smallest HPWL and area overheads in reasonable running time.
机译:混合单元高度电路已在先进技术中占据主导地位,可满足各种设计需求。随着器件的扩展,复杂的最小植入面积(MIA)约束成为现代电路设计中的一个新兴挑战,这增加了混合单元高度放置中的困难。现有的具有单行高度标准单元的MIA感知详细放置方式不足以用于混合单元高度设计:(1)填充物插入(通常用于解决MIA违规问题)可能会导致无法承受的面积和线长开销,以及(2)混合高度的细胞扰动可能会导致严重的行间MIA违规。本文提出了同时考虑行内和行间MIA约束来解决混合单元高度详细放置问题的第一项工作。我们首先通过对违反相同阈值电压的混合高度单元进行聚类来解决行内冲突,然后通过针对特殊情况应用高效,基于动态编程的最佳算法和算法DLX来扰动每个聚类以获得所需的单元排列对于一般的设备,可以实现混合单元高度重塑问题的可证明是恒定的性能比。使用基于网络流的配方,将剩余的侵犯细胞放置在适当的填充物插入位置,以解决违反细胞的问题并使面积最小化。在执行混合单元格高度的详细放置之后,我们最终通过将违规单元格移动到最小位移中来解决行间冲突。与填充插入方法和贪婪聚类方法相比,实验结果表明,本文提出的算法可以在合理的运行时间内以最小的HPWL和面积开销解决所有MIA违规问题。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号