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Evaluation of on-state resistance in gallium nitride based power electronic switches

机译:基于氮化镓的电力电子开关的通态电阻评估

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Gallium nitride (GaN) based high-electron-mobility transistor (HEMT) is getting popular in power electronics applications due to its low on-state resistance and superior switching characteristics. The on-state resistance of the switch is an important factor in the efficiency of the GaN switch based power converter. Firstly, the basic principle of operation of a normally-on GaN/AlGaN HEMT is reviewed. Then parallelization of several basic HEMT units internally to form a multi-finger-structured GaN device to achieve high current rating is illustrated. Later, estimation of the on-state resistance of a given device based on its internal structure and composition is attempted. Further, the variations in on-resistance with thickness of metalization of drain and source pads, length of the drain and source fingers, and the sheet resistance of two-dimensional electron gas (2DEG) are studied. This study on on-state resistance is used to provide architecture-level inputs to the design of a multi-finger GaN device for power electronics applications.
机译:基于氮化镓(GaN)的高电子迁移率晶体管(HEMT)由于其低导通电阻和出色的开关特性而在电力电子应用中变得越来越流行。开关的导通电阻是基于GaN开关的功率转换器效率的重要因素。首先,回顾了常开GaN / AlGaN HEMT的基本工作原理。然后说明了内部几个基本HEMT单元的并行化,以形成多指结构的GaN器件,以实现高额定电流。稍后,尝试基于给定设备的内部结构和组成来估计给定设备的导通状态电阻。此外,研究了漏极和源极焊盘的金属化厚度,漏极和源极指的长度以及二维电子气(2DEG)的薄层电阻的导通电阻的变化。这项关于通态电阻的研究用于为电力电子应用的多指GaN器件的设计提供体系结构级别的输入。

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