Electron multi-beam technology

摘要

So far, electron beam technology has found SC industrial applications mainly for e-beam inspection and for VSB (variable shaped beam) mask writers. When using a single electron beam, with VSB there are throughput limitations making it impossible to fulfill industrial demands of realizing leading-edge masks with <; 1 day write time for sub-10nm technology nodes. The only solution to the industrial needs is the implementation of electron multi-beam technology. IMS Nanofabrication has developed MBMW (multibeam mask writing) technology, realizing proof-of-concept tools in 2012, a full-field writing Alpha tool in 2014 (implementing a JEOL platform with air-bearing vacuum stage), Beta tools in 2015, and HVM (high-volume manufacturing) tools in 2016.