首页> 外文会议>International Symposium on VLSI Technology, Systems and Applications >TCAD based Design-Technology Co-Optimisations in advanced technology nodes
【24h】

TCAD based Design-Technology Co-Optimisations in advanced technology nodes

机译:先进技术节点中基于TCAD的设计技术共同优化

获取原文

摘要

In this paper we present and illustrate the concepts of TCAD based Design-Technology Co-Optimisation (DTCO) including both process-induced (global) and intrinsic (local) statistical variability. A generic 14nm FinFET CMOS technology is used to motivate and illustrate this study. Predictive Ensemble Monte Carlo (EMC) TCAD simulations have been carried out to evaluate the transistor performance. Drift diffusion (DD) simulations calibrated to the Ensemble Monte Carlo (EMC) simulation results are used to explore the process and the statistical variability space. The seamless execution of the DTCO flow has been enabled by the automation of the tool flow and the dataset handling. The interplay between the process and the statistical variability has been captured in details. A two-stage hierarchical compact model strategy is used to capture the interplay between process and statistical variability. Advances statistical compact model generation is used to study the impact of the variability on the circuit performance and yield at high sigma.
机译:在本文中,我们介绍并说明了基于TCAD的设计技术协同优化(DTCO)的概念,包括过程引起的(全局)和固有的(局部)统计变异性。通用的14nm FinFET CMOS技术被用来激励和说明这项研究。进行了预测整体蒙特卡洛(EMC)TCAD仿真,以评估晶体管的性能。校准为蒙特卡洛合奏(EMC)模拟结果的漂移扩散(DD)模拟用于探索过程和统计可变性空间。 DTCO流程的无缝执行已通过工具流程和数据集处理的自动化实现。详细记录了过程与统计变异性之间的相互作用。使用两阶段的分层紧凑模型策略来捕获过程和统计可变性之间的相互作用。使用先进的统计紧凑模型生成来研究可变性对高sigma时电路性能和良率的影响。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号