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SSTL based thermal and power efficient RAM design on 28nm FPGA for spacecraft

机译:SSTL基于SSTL的散步机28nm FPGA的热电型RAM设计

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In this paper, an approach is made to design a Thermal and Power efficient RAM for that reason we have used DDR4L memory and six different members of SSTL I/Os standards on 28nm technology. Every spacecraft requires most energy efficient electronic system and for that very purpose we have designed the most energy efficient RAM. In this design, we have taken two main parameters for analysis that is frequency (1600 MHz) and Voltage (1.05V). DDR4L operates at the lowest Voltage compared to available RAM's. Environment (LFM, Heat Sink, and Capacitance) is kept constant. For the simulation of the logic, Xilinx is used with Verilog as hardware description language. We have done our analysis with different I/O standards for DDR4L RAM. When we scale down from 288.15K to 348.15K there is maximum total power reduction in SSTL135_R as compared to all considered I/O standards. When we compared different members of SSTL for different temperatures and I/O power we observed maximum thermal efficiency in SSTL135_R at minimum and maximum temperature as compared to all other considered I/O standards. When we scale down from 348.15K to 288.15K there is no power reduction in Clock power, Logic power, Signal power, BRAMs and I/Os power respectively.
机译:在本文中,采用一种方法来设计热量和功率效率的RAM,因为我们已经使用了DDR4L存储器和28nm技术的SSTL I / OS标准的六个不同成员。每种航天器都需要大多数节能电子系统,为此,我们设计了设计最有效的RAM。在这种设计中,我们已经采取了两个主要参数,用于分析为频率(1600 MHz)和电压(1.05V)。与可用RAM相比,DDR4L以最低电压运行。环境(LFM,散热器和电容)保持恒定。对于逻辑的模拟,Xilinx与Verilog用作硬件描述语言。我们对DDR4L RAM的不同I / O标准进行了分析。当我们从288.15k缩小到348.15k时,与所有考虑的I / O标准相比,SSTL135_R的总功率降低最大。当我们与不同温度和I / O功率进行比较不同的SSTL成员时,与所有其他考虑的I / O标准相比,我们在最小和最高温度下观察到SSTL135_R中的最大热效率。当我们从348.15K缩小到288.15K时,分别没有时钟电源,逻辑功率,信号电源,糟糕和I / O / O / O / O / O / O / O / O / O / O / O / O / OS功率。

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