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SiC/GaN Power Semiconductor Devices Theoretical Comparison and Experimental Evaluation

机译:SiC / GaN功率半导体器件的理论比较和实验评估

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SiC and GaN power transistors conduction loss and switching losses are compared in this paper. In order to compare performance of the same power rating device, a theoretical analysis is given to compare SiC device conduction loss and switching losses change when device maximal blocking voltage reduces by half. Then static and dynamic characteristics of commercial SiC and GaN power transistors are compared and it is shown that GaN- HEMT would still have smaller ON-state resistance and inter-electrode capacitance in comparison with a 600V SiC device. After that, switching losses Esw of a GaNHEMT is measured and compared with that of a 1200V SiCJFET and a 600V SiC-MOSFET, in which it is shown that Esw of a GaN-HEMT is smaller than a SiC power transistor with the same power rating.
机译:本文比较了SiC和GaN功率晶体管的导通损耗和开关损耗。为了比较同一额定功率器件的性能,进行了理论分析,以比较当器件最大阻断电压降低一半时,SiC器件的导通损耗和开关损耗的变化。然后比较了商用SiC和GaN功率晶体管的静态和动态特性,结果表明,与600V SiC器件相比,GaN-HEMT仍将具有较小的导通态电阻和极间电容。之后,测量GaNHEMT的开关损耗Esw并将其与1200V SiCJFET和600V SiC-MOSFET的开关损耗进行比较,结果表明,GaN-HEMT的Esw小于相同功率额定值的SiC功率晶体管。

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