Performance degradation analysis and reliability statistical inference of PCB

摘要

As few or no failures occur during life test and accelerated life test for long-lifetime products, FR-4 printed circuit boards (PCBs) are employed as research objects to conduct performance degradation test under high temperature and humidity. Based on the analysis of the failure mode, failure mechanism and the study on the degradation parameters of PCB, the degradation failure model of PCB is built which is related to bias voltage in high temperature and humidity. Based on the statistical analysis method on performance degradation data, a reliability evaluation method of degradation paths is developed for reliability inference of PCB. Finally, the statistical result about pseudo-failure lifetime data under Weibull distribution is given, which confirms its validity and effectiveness.