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Electrothermal characterization of SOI FinFETs

机译:SOI FinFET的电热特性

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Electrothermal characterization of the advanced SOI FinFETs is performed in this paper, which is based on some analytical equations as well as in-house developed finite difference algorithm. The temperature-dependent properties of thermal conductivities of all materials involved are considered in our simulation, with results validated by the commercial software ANSYS and other analytical solution. The self-heating effects (SHE) in such FinFET at 50nm node are further investigated, and some analytical equations are derived for fast predicting the maximum temperature in its channel. On the other hand, transient temperature response under the circuit-speed random stress is also studied, which is mimicked by the Pseudo Random Binary Sequence signal. It is found that the AC and PRBS signals introduce the similar transient temperature response, while the lower frequency signal induces the worse self-heating effect.
机译:本文进行了先进的SOI FinFET的电热表征,这是基于一些分析方程以及内部开发的有限差分算法。在我们的仿真中考虑了所有涉及的所有材料的热导体的温度依赖性特性,通过商业软件ANSYS和其他分析解决方案验证的结果。进一步研究了在50nM节点处在这样的FinFET中的自热效应(SHE),并导出一些分析方程以快速预测其通道中的最高温度。另一方面,还研究了在电路速度随机应力下的瞬态温度响应,由伪随机二进制序列信号模拟。结果发现,AC和PRBS信号引入了类似的瞬态温度响应,而较低频率信号会引起更差的自热效果。

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