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Enhanced efficacy of a novel atmospheric non-thermal microplasma brush for surface sterilization

机译:新型大气非热微等离子体刷对表面消毒的功效增强

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Summary form only given. The application of non-thermal plasmas for surface sterilization is of particular interest due to the increase of secondary infections in hospitals by drug resistant strains of bacteria. Traditional sterilization methods are often too harsh for sensitive equipment and surfaces, and non-equilibrium plasma has been investigated as an alternative. This work details the development and improved efficacy of an atmospheric non-thermal plasma brush for the surface inactivation of bacteria. The plasma brush, driven by 145 ns 9.5 kV pulses at a repetition rate of 2 kHz, consists of 11 microplasma plumes that are 12 mm long, 1.5 mm wide and 0.11 mm thick each. Bacterial inactivation studies were performed on two common nosocomial pathogens, Acinetobacter baumannii and Staphylococcus aureus, inoculated to laminate plates. At a flow rate of 1 slpm of helium and a 5 mm nozzle to surface distance, only 0.2 log (37%) reduction was achieved on a dry laminate surface for a treatment time of 5 minutes. Application of a thin layer of water to the treatment surface increased the reduction by 100-fold (2.2 log reduction, 99.4%) compared to the treatment for a dry surface. Addition of water vapor to the helium flow was also able to improve the inactivation efficacy. Bacterial inactivation was maximized at 1.1 log (92%) for He/(1.4%)H2O with the plasma jet applied to dry laminate surfaces. Optical emission spectroscopy was performed for the plasma brush at various conditions to determine the changes in the production of electronically excited species in the presence of water at the treatment surface and in the feed gas.
机译:仅提供摘要表格。由于医院中耐药菌菌株继发感染的增加,非热等离子体在表面灭菌中的应用引起了人们的特别关注。对于敏感的设备和表面,传统的灭菌方法通常过于苛刻,已对非平衡等离子体进行了研究。这项工作详述了大气非热等离子体刷在细菌表面失活方面的发展和提高的功效。等离子体刷由145 ns 9.5 kV脉冲以2 kHz的重复频率驱动,由11个微等离子体羽组成,分别为12毫米长,1.5毫米宽和0.11毫米厚。对接种在层压板上的两种常见的医院病原体鲍曼不动杆菌和金黄色葡萄球菌进行了细菌灭活研究。在氦气流量为1 slpm且喷嘴到表面距离为5 mm的情况下,在干燥的层压板表面上进行5分钟的处理,仅减少了0.2 log(37%)。与干燥表面的处理相比,在处理表面上施加一层薄薄的水可使减少量增加100倍(减少2.2 log,减少99.4%)。将水蒸气添加到氦气流中也能够提高灭活效力。通过将等离子流施加到干燥的层压板表面,可以使He /(1.4%)H2O的细菌灭活达到1.1 log(92%)的最大值。在各种条件下对等离子刷进行光发射光谱分析,以确定在处理表面和进料气中存在水的情况下电子激发物质产生的变化。

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