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Growth of AlGaN on silicon substrates, a novel way to make back-illuminated ultraviolet photodetectors

机译:AlGaN在硅基板上的生长,一种制备后照射紫外线光电探测器的新方法

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AlGaN, with its tunable wide-bandgap is a good choice for the realization of ultraviolet photodetectors. AlGaN films tend to be grown on foreign substrates such as sapphire, which is the most common choice for back-illuminated devices. However, even ultraviolet opaque substrates like silicon holds promise because, silicon can be removed by chemical treatment to allow back-illumination, and it is a very low-cost substrate which is available in large diameters up to 300 mm. However, Implementation of silicon as the solar-blind PD substrates requires overcoming the lattice-mismatch (17%) with the Al_xGa_(1-x)N that leads to high density of dislocation and crack-initiating stress. In this talk, we report the growth of thick crack-free AlGaN films on (111) silicon substrates through the use of a substrate patterning and mask-less selective area regrowth. This technique is critical as it decouples the epilayers and the substrate and allows for crack-free growth; however, the masking also helps to reduce the dislocation density by inclining the growth direction and encouraging dislocations to annihilate. A back-illuminated p-i-n PD structure is subsequently grown on this high quality template layer. After processing and hybridizing the device we use a chemical process to selectively remove the silicon substrate. This removal has minimal effect on the device, but it removes the UV-opaque silicon and allows back-illumination of the photodetector. We report our latest results of back-illuminated solar-blind photodetectors growth on silicon.
机译:Algan,其可调宽带隙是实现紫外线光电探测器的良好选择。 AlGaN薄膜往往会在类似于蓝宝石的外来基板上生长,这是背照射装置最常见的选择。然而,即使是硅等紫外线不透明基板也承受承诺,因为,可以通过化学处理去除硅以允许背部照射,并且是一个非常低成本的基板,其大直径可达300mm。然而,作为太阳盲PD基板的硅的实现需要克服与AL_XGA_(1-X)N的晶格 - 失配(17%)导致高密度的位错和发动引发应力。在这次谈话中,我们通过使用基板图案化和掩模的选择性区域再生来报告(111)硅基板上的厚易裂的AlGaN薄膜的生长。这种技术是至关重要的,因为它脱离了脱毛器和基材并允许无裂缝的生长;然而,掩模还有助于通过倾斜生长方向并促使脱离剥离来降低位错密度。随后在该高质量的模板层上生长了后照射的P-I-N Pd结构。在处理和杂交装置之后,我们使用化学过程来选择性地去除硅衬底。这种去除对装置具有最小的影响,但是它去除UV-Mopaque硅并允许光电探测器的反向照射。我们报告了我们的最新结果的背光阳光盲光电探测器在硅上的生长。

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