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Electric-Field Assisted Assembly of Core-Shell Nanoparticle Arrays for Contact Hole Patterning

机译:电磁辅助组装芯壳纳米粒子阵列接触孔图案化

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In this paper, we investigate an electric-field assisted assembly approach to create dense arrays of contact hole patterns with complex feature geometries. This hybrid strategy uses a spatially varying dielectrophoretic (DEP) force created by lithographically defined guiding features to assemble dense arrays of nanoparticles within the features, thereby replicating features within the starting pattern. For close-packed particle arrays, the half- and full-pitch of the contact hole array is defined by the starting nanoparticle core and shell diameter.
机译:在本文中,我们研究了一种电场辅助组装方法,以创造具有复杂特征几何形状的致密的接触孔图案阵列。该混合策略使用由光刻限定的引导特征产生的空间变化的介电泳(DEP)力,以将纳米颗粒的致密阵列组装在特征内,从而复制起始图案内的特征。对于封闭填充粒子阵列,接触孔阵列的半和全距间距由起始纳米颗粒芯和壳体直径限定。

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