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III–V and Ge/strained SOI tunneling FET technologies for low power LSIs

机译:适用于低功率LSI的III–V和Ge /应变SOI隧道FET技术

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We have demonstrated high performance operation of planar-type tunnel field-effect transistors (TFETs) using Ge/ III-V materials. Tensile strain in Si channels combined with the Ge source can enhance the tunneling current because of the reduced effective bandgap. The fabricated Ge/sSOI (1.1 %) TFETs show high I/I ratio over 10 and steep minimum subthreshold slope (SS) of 28 mV/dec. It is found that I and SS are improved by positive back bias. We have also demonstrated the operation of high I/I and low SS planar-type InGaAs Tunnel FETs with Zn-diffused source junctions. Solid-phase Zn diffusion can realize steep-profile and defect-less p source junctions. The small S.S. of 64 mV/dec and large I/I ratio over 10 have been realized in the planar-type III-V TFETs.
机译:我们已经证明了使用Ge / III-V材料的平面型隧道场效应晶体管(TFET)的高性能操作。由于有效带隙减小,Si通道中的拉伸应变与Ge源结合可以增强隧穿电流。制成的Ge / sSOI(1.1%)TFET在10倍以上具有很高的I / I比,并且最小的亚阈值斜率(SS)为28 mV / dec。发现通过正反向偏置可以改善I和SS。我们还演示了具有Zn扩散源极结的高I / I和低SS平面型InGaAs隧道FET的操作。固相锌扩散可以实现陡峭轮廓和无缺陷的p / n源结。在平面型III-V TFET中已经实现了64 mV / dec的小S.S.和超过10的I / I大比率。

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