Combine partial EBG structure and Z-shape power bus for noise isolation in multi-layer PCBs

摘要

The ground bounce noise (GBN) in high-integrative and high-complexity circuit designs is discussed in this paper. GBN doesn't only transmit its own power and ground plane but also couple to power and ground plane nearby. Therefore, power integrity (PI) will be affected by GBN. I use the segmentation method to cut off the cavity model of PCB. Here, I embed partial electromagnetic bandgap (EBG) structure and Z-shape power bus to isolate the noise power and ground planes. Then, partial EBG structure and Z-shape power bus are implanted to form stop-band characteristics. We can find noise isolation has the same effect as the period EBG structure. Through this modelling method, we can separate the stop-band and pass-band in Z-shape and EBG individually. In the model, the PCB is divided into five segments of different sizes and rectangular power and ground plane. Through the mushroom-shape (Mushroom-like) EBG, these structures are connected as part of a vertical blind hole, rectangular resonant cavity and the transmission line model to describe the Z-shape power bus. From practices and proposed methods, we can effectively improve result of isolating the power and ground noise simulation and implement.