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Compressive sensing method for production chip test

机译:用于生产芯片测试的压缩感测方法

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IC testing is an essential part of semiconductor manufacturing, the silicon chips are deserved to be tested and characterized carefully to get the variation information, however, the traditional testing methods suffer from time consuming, time costing and large area overhead. Compressive Sensing (CS) illustrates that a signal can be perfectly reconstructed from fewer samples than the Nyquist-Shannon sampling theorem requires. CS takes advantage of the signal's sparseness in some domains, allowing the entire signal to be determined from relatively few measurements. The Linear Dynamical System (LDS) framework is regarded as an important class of parametric models for time-series data. This paper designed an algorithm for the bulk production chip testing based on CS theory. The data to be tested is the numerical variations of chips one by one from the same lot, the purpose of our project is to recover all the data from limited few samples as accurate as possible, and the main idea is to estimate the LDS parameter from compressive measurements.
机译:IC测试是半导体制造的必要部分,硅芯片应仔细测试并仔细测试以获得变化信息,然而,传统的测试方法遭受耗时,时间成本和大面积开销。压缩感测(CS)示出了比奈奎斯语 - 香农采样定理从更少的样本完全重建信号。 CS利用了一些域中的信号的稀疏性,允许从相对较少的测量中确定整个信号。线性动力系统(LDS)框架被认为是时间序列数据的重要类参数模型。本文设计了一种基于CS理论的散装生产芯片测试的算法。要测试的数据是从同一批次逐个筹码的数值变化,我们项目的目的是尽可能准确地将所有数据从有限的样本中恢复,并且主要思想是估计LDS参数压缩测量。

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