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Tutorial T5: High Performance Low Power Designs - Challenges and Best practices in Design, Verification and Test

机译:教程T5:高性能低功耗设计-设计,验证和测试中的挑战和最佳实践

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Demand for highly mobile and lower form-factor designs is driving semiconductor industry towards lower and lower power envelopes even for complex SOCs. With performance targets being expected to grow with every advancement in process technology, it becomes very difficult to achieve low power targets especially with shrinking geometries resulting in more pronounced second order effects in devices and interconnect. This tutorial is intended to cover some key challenges and best practices of design, verification and test domains for high performance ICs in low power space. First section starts off by explaining the basic trade-off between performance and power followed by how margins are used in various phases of design and analysis for better predictability of silicon behavior. It then covers the need for custom designs which could impact time-to-market but cannot be avoided due to the tighter and tighter specs on power and performance with every technology shift. This section concludes by discussing the impacts of overdesign and how they can be alleviated with some good practices during design phase. Second section covers the challenges involved in SOC-level and system-level verification of such high-performance designs with increased percentage of mixed-signal IP in them. It talks about some specific IPs and how to handle complex interactions between analog and digital domains there. It then covers the trade-off seen between speed and accuracy and associated best practices; and also covers some other common challenges like port order mismatches, etc. The final section addresses the challenge of testing the high performance designs especially given the process and design variability. For a long time semiconductor yield has been limited by random particle based issues and accordingly testing was geared towards detecting such defects. However, at feature sizes 65nm and below and with increased shift towards squeezing performance and power, systematic and process varia- ility issues have begun to contribute significantly towards the yield fallout. In keeping up with this, testing has to adapt to be able to identify good devices from bad or not-so-good devices in the presence of variability. This section, after quickly summarizing the fundamentals will address advanced topics such as power-aware, timing-aware and variability aware test techniques and on-chip test structures and techniques that can be used to predict correlation between speed and power of the designs. The proposed tutorial quickly touches upon the basics to be of interest to students, new engineers and managers but primarily focuses on covering the key challenges seen across the industry today in design, verification and test phases of complex high performance SOCs in low power space. Since it covers multiple domains, the content should be of interest to a wide range of students, scholars and engineers.
机译:即使对于复杂的SOC,对高流动和较低的形状设计的需求正在推动半导体行业朝向更低和较低的电源信封。随着工艺技术的每一个进步,预计绩效目标会随着过程技术的每一个进步而增长,尤其难以实现低功率目标,特别是在缩小的几何形状中导致设备和互连中的更明显的二阶效应。本教程旨在为低功耗空间中的高性能ICS提供一些关键挑战和最佳设计,验证和测试域。第一部分通过解释性能和功率之间的基本权衡,然后在各个阶段使用的硅行为的各个阶段使用的基本权衡来开始。然后,它涵盖了对可能影响到上市时的定制设计的需求,而无法避免由于每个技术偏移的功率和性能更紧密和更严格。本节通过讨论过度设计的影响以及如何在设计阶段进行一些良好的做法来结束。第二部分涵盖了SOC级和系统级验证的挑战,这些高性能设计,其中混合信号IP百分比增加。它谈到了一些特定的IP,以及如何在那里处理模拟和数字域之间的复杂交互。然后,它涵盖了速度和准确性和相关的最佳实践之间的权衡;并且还包括端口订单不匹配等其他常见挑战等。最后一节讲述了测试高性能设计的挑战,特别是鉴于过程和设计可变性。由于长时间半导体产量受到随机粒子的问题受到限制,因此测试朝向检测这些缺陷进行齿轮。然而,在特征尺寸65nm和以下,并且随着挤压性能和功率的增加而增加,系统和过程的变化问题已经开始对产量辐射作出显着贡献。在跟上这一点时,测试必须适应能够在有变异性存在下识别来自坏或不良设备的好装置。这一部分在快速总结基本面后,将解决高级主题,如动力感知,时序感知和可变性感知测试技术和片上测试结构和技术,可用于预测设计速度和功率之间的相关性。建议的教程迅速触及学生,新工程师和经理感兴趣的基础知识,而且主要侧重于涵盖当今业界在整个行业中看到的关键挑战,在低功率空间中的复杂高性能SOC的设计,验证和测试阶段。由于它涵盖了多个域,因此内容应该对广泛的学生,学者和工程师感兴趣。

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