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EFFECT OF MACHINING PARAMETERS ON SURFACE ROUGHNESS IN μ-EDM OF CONDUCTIVE SiC

机译:加工参数对导电性SiCμ-EDM表面粗糙度的影响

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Micro-electrical discharge machining (μ-EDM) is a non-traditional manufacturing technique that has been widely used in the production of precision engineering components throughout the world in recent years. The most important performance measure in μ-EDM is the surface roughness. The Silicon Carbide is a reaction bonded advanced ceramic that is the fourth hardest material after Diamond, boron nitride and boron carbide. Due to low fracture toughness, machining of Silicon Carbide is accomplished with EDM. In this study, the experimental studies were conducted under varying gap voltage, capacitance and threshold. The numbers of experiments were reduced by L9 array of Taguchi's theory of DOE. Signal-to-noise (S/N) ratio was employed to determine the most influencing levels of parameters that affect the surface roughness in the μ-EDM of conductive silicon carbide. To validate the study, confirmation experiment has been carried out at optimum set of parameters and predicted results have been found to be in good agreement with experimental findings. A fuzzy logic model for predicting surface roughness during μEDM was also developed on MATLAB software and the goodness of fit of predicted values with experimental values was tested using chi-square test.
机译:微放电加工(μ-EDM)是一种非传统的制造技术,近年来已在全世界的精密工程零件生产中广泛使用。 μ-EDM中最重要的性能指标是表面粗糙度。碳化硅是一种反应粘合的高级陶瓷,是仅次于金刚石,氮化硼和碳化硼的第四高硬度材料。由于较低的断裂韧性,因此用EDM可以加工碳化硅。在这项研究中,实验研究是在变化的间隙电压,电容和阈值下进行的。 Taguchi的DOE理论的L9阵列减少了实验次数。信噪比(S / N)用于确定影响导电碳化硅的μ-EDM中表面粗糙度的参数的最大影响水平。为了验证该研究,已在最佳参数集上进行了确认实验,并且发现预测结果与实验结果非常吻合。还在MATLAB软件上开发了用于预测μEDM过程中表面粗糙度的模糊逻辑模型,并使用卡方检验测试了预测值与实验值的拟合优度。

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