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Integrating the quadrupole mass spectrometer, optical emission spectroscopy and Langmuir probe as a plasma characterization tools for ECR-CVD with a-Si:H

机译:将四极杆质谱仪,光发射光谱仪和Langmuir探针集成在一起,作为使用a-Si:H进行ECR-CVD的等离子体表征工具

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We present the application of quadrupole mass spectrometer (QMS), optical emission spectroscopy (OES), and Langmuir probe (LP) as an integrated technique for plasma characterization of the process during electron cyclotron resonance chemical vapor deposition (ECR-CVD) of hydrogenated amorphous silicon (a-Si:H). The main aim of this study was to investigate the use of QMS to determine the relationship between plasma and thin film characteristics, in particular microstructure parameter (R~*) and hydrogen content (C_H). The OES was used to assist the QMS in measuring the light and simple radicals, such as the H, Si and SiH, and the associated physical plasma properties which include electron density (N_e), electron energy (T_e) and sheath potential (V_s) would be studied with the Langmuir probe. The effects of the two ECR-CVD parameters, namely the power density (1 ~ 4 w/cm~2) and hydrogen dilution ratio (H_2/SiH_4, 0 ~ 25) were discussed. The results indicated that there is a very obvious difference in QMS analysis between plasma and gas, and it is due to the fact that the QMS analysis of plasma is accompanied with the vapor and surface reactions. Therefore, the consumption of parent molecule (SiH_4) needed to be considered. The TIMS (Threshold ionization mass spectrometry) method which is usually applied to estimate the relative density trends of the ground-state silane radicals (SiH_x, x < 4) was used in this study. It was found that increasing power density and hydrogen dilution ratio would lead to higher electron density and more SiH_2 generated in the plasma. Furthermore, when comparing with the TIMS analysis reported by other authors, we found the ratio of SiH_2 to SiH_3 from QMS could be considered as a better indicator of film quality for R~*.
机译:我们介绍了四极质谱仪(QMS),光发射光谱法(OES)和Langmuir探针(LP)的应用,该技术是对氢化非晶态电子回旋共振化学气相沉积(ECR-CVD)过程进行等离子体表征的一种集成技术硅(a-Si:H)。这项研究的主要目的是研究使用QMS来确定等离子体和薄膜特性之间的关系,特别是微观结构参数(R〜*)和氢含量(C_H)。 OES用于协助QMS测量轻原子和简单原子团,例如H,Si和SiH,以及相关的物理等离子体特性,包括电子密度(N_e),电子能量(T_e)和鞘层势(V_s)将使用Langmuir探针进行研究。讨论了两个ECR-CVD参数的影响,即功率密度(1〜4 w / cm〜2)和氢稀释比(H_2 / SiH_4,0〜25)。结果表明,等离子体和气体之间的QMS分析存在非常明显的差异,这是由于等离子体的QMS分析伴随着气相反应和表面反应这一事实。因此,需要考虑母体分子(SiH_4)的消耗。在本研究中,通常使用TIMS(阈值电离质谱)方法来估计基态硅烷自由基(SiH_x,x <4)的相对密度趋势。发现增加功率密度和氢稀释比将导致更高的电子密度和在等离子体中产生更多的SiH_2。此外,与其他作者的TIMS分析相比,我们发现来自QMS的SiH_2与SiH_3的比率可以被认为是R〜*薄膜质量的更好指标。

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