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Performance of Four-stage Thermoelectric Cooler for Extended Wavelength InGaAs Detectors

机译:四级热电冷却器的延伸波长IngaAs探测器的性能

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摘要

Experimental setup for evaluating four-stage thermoelectric cooler's performance was designed. Effects of input power, heat dissipation condition and heat load on the temperature difference (ΔT) of four-stage thermoelectric coolers' hot and cold faces were obtained experimentally. The result shows that, the ΔT increases as the input power increases. A linear relationship exists between input current and feedback voltage. In different cooling conditions, the ΔT of thermoelectric cooler (TEC) increases with the temperature of hot face. As the temperature increasing on hot face is 1K, the ΔT increasing of TEC can be about 0.5K. Meanwhile, the power consumption of TEC also increases slightly. Water condensation can be prevented in either dry nitrogen environment or vacuum environment, but the vacuum level has great influence to the ΔT, especially in low operation temperature. The better the vacuum level is, the smaller the convection heat loss has. When the operation temperature of focal plane array (FPA) is lower than 220K, it is prior to use vacuum packaging. Considering the Joule-heat of readout circuit and the heat loss of wire conduction, the minimum working temperature of FPA can reach below 200 K when the temperature of the hot face is 285K. And the coefficient of performance (COP) of TEC can increase sharply from 0.8% to 4% when the controlled operation temperature is 220K rather than 200K.
机译:设计了评估四级热电冷却器性能的实验设置。实验获得了四阶段热电冷却器热和冷面的输入功率,散热条件和热负荷对温度差(ΔT)的影响。结果表明,随着输入功率的增加,ΔT增加。输入电流和反馈电压之间存在线性关系。在不同的冷却条件下,热电冷却器(TEC)的ΔT随着热面的温度而增加。随着热面上的温度增加,TEC的ΔT增加可以为约0.5k。同时,TEC的功耗也略有增加。可以在干燥的氮环境或真空环境中防止水冷凝,但真空水平对ΔT产生很大影响,特别是在低操作温度下。真空水平越好,对流热损失越小。当焦平面阵列(FPA)的操作温度低于220K时,它在使用真空包装之前。考虑到读出电路的焦耳热量和导线传导的热量损失,当热面温度为285k时,FPA的最小工作温度可达200​​ k以下。当受控操作温度为220k而不是200k时,TEC的性能系数(COP)可能会增加0.8%至4%。

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