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Improved surge protection of flip-chip gallium nitride-based HEMTs by metal-semiconductor-metal two-dimensional electron gas varactor

机译:金属-半导体-金属二维电子气变抗器改善了倒装芯片氮化镓基HEMT的电涌保护

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AlGaN/GaN high electron mobility transistor (HEMT) was designed with improved surge protection characteristic through the use of a MSM-2DEG varactor connected in series to the gate of HEMT. Under an ESD surge stress of 1100 V or below, the HEMT incorporating this protection feature doesn't exhibit any change because the surge stress can be directly blocked by the MSM-2DEG varactor. Furthermore, flip-chip (FC) technology was also used to further improve the thermal performance and reliability of HEMTs. The heat generated in the two-dimensional electron gas (2DEG) channel of HEMT flows directly through the interconnect metal to the submount, and hence improve the thermal conduction. Based on these results, the proposed flip-chip HEMT with MSM-2DEG varactor can effectively improve the surge protection characteristics.
机译:通过使用与HEMT栅极串联的MSM-2DEG变容二极管,设计了具有改进的电涌保护特性的AlGaN / GaN高电子迁移率晶体管(HEMT)。在ESD浪涌应力为1100 V或更低的情况下,具有此保护功能的HEMT不会发生任何变化,因为浪涌应力可以被MSM-2DEG变容二极管直接阻挡。此外,倒装芯片(FC)技术还用于进一步提高HEMT的热性能和可靠性。 HEMT的二维电子气(2DEG)通道中产生的热量直接流过互连金属到达基座,因此改善了热传导。基于这些结果,提出的带有MSM-2DEG变容二极管的倒装芯片HEMT可以有效地改善电涌保护特性。

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