III-V semiconductors; aluminium compounds; electrostatic discharge; flip-chip devices; gallium compounds; heat conduction; high electron mobility transistors; metal-semiconductor-metal structures; semiconductor device reliability; surge protection; two-dimensional electron gas; varactors; wide band gap semiconductors; 2D electron gas channel; AlGaN-GaN; ESD surge stress; HEMT; MSM-2DEG varactor; flip-chip technology; high electron mobility transistor; metal-semiconductor-metal 2D electron gas varactor; surge protection; thermal conduction; Electrostatic discharges; Gallium nitride; HEMTs; Logic gates; MODFETs; Stress; Varactors; GaN; flip-chip; high electron mobility transistor (HEMT); surge protection; varactor;
机译:通过使用基于AlGaN / GaN的金属-半导体-金属二维电子气敏电阻改善电涌保护
机译:质子辐照氮化镓基二维电子气系统的输运性质
机译:通过使用简单的n型电极图案改善大功率氮化铟镓/氮化镓基垂直发光二极管的性能
机译:通过引入金属-绝缘体-金属电容器提高氮化镓基倒装芯片HEMT的ESD鲁棒性
机译:氮化镓基和高速金属-半导体-金属光电探测器:集成生长和器件结构。
机译:二维电子气上的供体样表面陷阱以及AlGaN / GaN HEMT的电流崩塌
机译:高K栅叠层氮化镓基金属氧化物半导体高电子迁移率晶体管的表征和数值模拟
机译:氮化硅钝化层变化对电子辐照氮化铝镓/氮化镓HEmT结构的影响