【24h】

Radiation damaging of semiconductor materials

机译:半导体材料的辐射损伤

获取原文

摘要

The formation of porosity in 3C-SiC thin layer of a metal substrate is studied in the paper. The mathematical model of radiation damaging of semiconductors can be utilized in development of perspective materials such as a porous silicon carbide. Implanting inert gases into solids initiates a phase transition of the first kind and produces pores (or blisters of neutral gases) in a thin crystal lattice layer of a 3C-SiC semiconductor. A radiation flux of high energy Xe ions stimulates the nucleation of lattice defects. The initial stage of phase transitions in case of not equilibrium defects clustering is described by stochastic models. Kinetic Kolmogorov equations formulated for probability density of Markov random processes and stochastic Ito-Stratonovich differential equations /SDEs/ are used to obtain non-equilibrium distribution functions /DF/ of pores with respect to sizes and lattice's positions. We show that damaging silicon carbide on boundary SiC/Mo layers can be predicted (with account of indirect elastic forces) by computer simulation. The same process as the method of porosity creation in semiconductors can be considered as alternative to etching.
机译:本文研究了金属基底的3C-SiC薄层中孔隙的形成。半导体辐射破坏的数学模型可用于开发透视材料(例如多孔碳化硅)。将惰性气体注入固体中会引发第一种相变,并在3C-SiC半导体的薄晶格层中产生孔(或中性气体的气泡)。高能Xe离子的辐射通量会激发晶格缺陷的形核。在非平衡缺陷聚集的情况下,相变的初始阶段由随机模型描述。为马尔可夫随机过程的概率密度制定的动力学Kolmogorov方程和随机的Ito-Stratonovich微分方程/ SDEs /用于获得关于尺寸和晶格位置的孔的非平衡分布函数/ DF /。我们表明,可以通过计算机模拟预测(由于间接弹力的影响)边界SiC / Mo层上的碳化硅损坏。与蚀刻中的孔隙形成方法相同的工艺可以被认为是蚀刻的替代方法。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号